METHOD FOR CUTTING SINGLE CRYSTAL INGOT BY WIRE SAW

PROBLEM TO BE SOLVED: To provide a method for cutting a single crystal ingot by a wire saw in which the efficiency of face matching work is good and the precision of face matching is high when the single crystal ingot is cut in parallel with the end surface of the ingot. SOLUTION: In the method for...

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Hauptverfasser:	HORIGUCHI TADASHI, MORI MASAMI, MASUYAMA SHOJI, WATANABE NOBUFUMI, NARITA YOSHIHIRO, TERUNUMA KOYU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CRYSTAL GROWTH DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS METALLURGY PERFORMING OPERATIONS PHYSICS POLISHING PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SEMICONDUCTOR DEVICES SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH TESTING TRANSPORTING UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for cutting a single crystal ingot by a wire saw in which the efficiency of face matching work is good and the precision of face matching is high when the single crystal ingot is cut in parallel with the end surface of the ingot. SOLUTION: In the method for cutting the single crystal ingot by the wire saw, the single crystal ingot 32 mounted/fixed on/to a swivel table 31 is cut in parallel with the ingot end surface 32a by using the wire saw 33. The inclination of the ingot end surface 32a is detected/measured by laser displacement sensors 11-13, and the inclination angle of the end surface 32a is calculated. The inclination of the end surface 32a is corrected on the basis of the inclination angle. COPYRIGHT: (C)2004,JPO&NCIPI