METHOD OF MANUFACTURING SUBSTRATE FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for an electronic component with which the manufacturing is easy; production efficiency is excellent; the material cost is reduced resulting in total cost reduction; and thinning can be achieved. SOLUTION: A flexible circuit substrate 20 is accommodated in a cavity C1 formed by a first and a second metal molds 41, 45 in such a way that a surface of the flexible circuit substrate 20 touches an inner plane surface C11 of the cavity C1. Then, the cavity C1 is filled with a molten molding resin. After the filling molding resin is solidified, the first and the second metal molds 41, 45 are removed, and an insulating base pedestal 10, which is composed of the molding resin and on the upper face of which the flexible circuit substrate 20 is mounted, is obtained. After then, terminal plates 70, 70 are mounted at an edge of the insulating base pedestal 10 so as to be connected to terminal patterns 29, 29 formed on the flexible circuit substrate 20. COPYRIGHT: (C)2004,JPO&NCIPI