SUBSTRATE FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a substrate for electronic components, which can be made thin easily and in which the cost can be reduced by reducing the material cost while enhancing the production efficiency. SOLUTION: The substrate 10 for electronic components comprises an insulating base 10, and a flexible board 20 provided with terminal patterns 29 and 29 and a conductor pattern 25 having a surface slid by a slider on a synthetic resin film being fixed onto the insulating base 10, and terminal boards 70 and 70 being fixed to the end part of the insulating base 10 while connected with the terminal patterns 29 and 29. The insulating base 10 is a synthetic resin molding and the flexible board 20 is insert molded on the insulating base 10. COPYRIGHT: (C)2004,JPO&NCIPI