SUBSTRATE FOR ELECTRONIC COMPONENT

SUBSTRATE FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a low-cost substrate for electronic components exhibiting good temperature and moisture characteristics for which production is facilitated and productivity is enhanced. SOLUTION: The substrate 1-1 for electronic components comprises an insulating base 10, and a flex...

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Bibliographische Detailangaben
Hauptverfasser: MITSUI KOJI, FUKUDA NAOKI, YANOSHITA KATSUTOSHI, MAKINO DAISUKE, NAKAGOME KAZUTAKA, MORITA KOZO, MIZUNO SHINJI, SHINOKI TAKASHI, SUZUKI SHINICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
RESISTORS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a low-cost substrate for electronic components exhibiting good temperature and moisture characteristics for which production is facilitated and productivity is enhanced. SOLUTION: The substrate 1-1 for electronic components comprises an insulating base 10, and a flexible board 20 provided with terminal patterns 29 and 29 and a conductor pattern 25 having a surface slid by a slider on a synthetic resin film being fixed onto the insulating base 10. The conductor pattern 25 comprises a metal thin film formed by physical vapor deposition or chemical vapor deposition. The insulating base 10 is a synthetic resin molding and the flexible board 20 is insert molded on the insulating base 10. COPYRIGHT: (C)2004,JPO&NCIPI