LAMINATING SYSTEM
PROBLEM TO BE SOLVED: To enhance the lamination strength of a laminated substrate. SOLUTION: In the laminating system of wafer, surface state of first and second substrates is measured by a measuring device in a chamber 201 isolated from the external space. Based on the measurements, surface of the...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PROBLEM TO BE SOLVED: To enhance the lamination strength of a laminated substrate. SOLUTION: In the laminating system of wafer, surface state of first and second substrates is measured by a measuring device in a chamber 201 isolated from the external space. Based on the measurements, surface of the first and second substrates is cleaned by a processing unit and then the first and second substrates are overlaid. The chamber isolates an operating unit for overlaying the substrates, the surface measuring device and the processing unit from the external space. COPYRIGHT: (C)2004,JPO&NCIPI |
|---|