OVERLAYING EQUIPMENT

OVERLAYING EQUIPMENT

PROBLEM TO BE SOLVED: To provide overlaying equipment capable of increasing the degree of freedom when substrates are overlaid. SOLUTION: The equipment for overlaying a first substrate 501 and a second substrate 503 comprises a mechanism for turning the first substrate 501 about a first axis, and a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: YANAGIDA KAZUTAKA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide overlaying equipment capable of increasing the degree of freedom when substrates are overlaid. SOLUTION: The equipment for overlaying a first substrate 501 and a second substrate 503 comprises a mechanism for turning the first substrate 501 about a first axis, and a mechanism for altering the position of the first axis wherein the first substrate 501 is moved and laid over the second substrate 503 by means of the turn mechanism and the altering mechanism. COPYRIGHT: (C)2004,JPO&NCIPI