MOUNTING STRUCTURE OF IMAGING DEVICE

PROBLEM TO BE SOLVED: To provide a mounting structure of an imaging device, which can provide a shield effect to a bare chip mounting part by making the circumference of a signal land the ground level when mounting and can prevent interference with other signals. SOLUTION: A conductive sheet film 14 with a conductive particle 15 is held and thermally compressed in a bare chip mounting part between an image sensing element 1 with a gold bump fixed on a land 4 and a GND land 5 and a multilayer substrate 13. The conductive sheet film 14 melts and the conductive particle 15 attaches between a gold bump 16 and lands 11, 12, thus realizing energization between the lands 11, 4 and between GND lands 12, 5. When the GND lands 12 and 5 are connected, the lands 4, 11 are airtightly shielded three-dimensionally by a solid GND land layer 20 and thereby interference of other signals from the outside and superposition of noises are prevented. COPYRIGHT: (C)2004,JPO&NCIPI