ELECTRONIC COMPONENT MOUNTING DEVICE

PROBLEM TO BE SOLVED: To provide an electronic component mounting device that can always mount electronic components on substrates with high accuracy by automatically correcting changes in positional relations among its components and the displacement of centers of rotation caused by the environmental temperature or secular changes while the device actually operates. SOLUTION: A table unit 36 equipped with a jig chip table 26 is provided closely to one of paired substrate guide rails 22. The jig chip table 26 is usually set to a stand-by state at a lower position where the table 26 does not come into contact with an electronic component 47 mounted on the rear surface of a carried-in both-sided substrate 46. In performing positional correction before the substrate 46 is carried in, the table 26 is raised to the position of the component mounting surface 46' of the substrate 46. The mounting head 34 corresponding to the jig chip table 26 places a jig chip component on the table 26 at a prescribed rotational angle and the substrate recognizing camera 35 of the same working head recognizes the jig chip component. Then the electronic component mounting device corrects the mounted jig chip component by recognizing the correct positional relation between the substrate recognizing camera 35 and a mounting head 34 and the rotated position of the component. COPYRIGHT: (C)2004,JPO&NCIPI