TRANSPARENT CONDUCTIVE LAMINATED FILM

PROBLEM TO BE SOLVED: To provide a transparent conductive laminated film which has the merits of an application method to produce a transparent conductive film having a large area at a high speed while suppressing its production costs and surface resistance impossible to attain by the application me...

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Bibliographische Detailangaben
1. Verfasser:	YAMADA NAOTOMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a transparent conductive laminated film which has the merits of an application method to produce a transparent conductive film having a large area at a high speed while suppressing its production costs and surface resistance impossible to attain by the application method alone by using the merits of a sputtering method to form a transparent conductive film low in resistance and excellent in durability and is excellent in adhesion properties. SOLUTION: In the transparent conductive laminated film, a transparent conductive layer is formed on a transparent polymer film substrate with a hard coat layer formed on at least one side through a backing layer of a silicon oxide film formed by applying a sol solution prepared by hydrolyzing an organic silicon compound. In the structure of the conductive layer, a sputter layer of a transparent conductive thin film formed by the sputtering method is laminated on an application layer of a transparent conductive thin film formed by the application method. COPYRIGHT: (C)2004,JPO&NCIPI