SYSTEM AND METHOD FOR TREATING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a substrate treating system by which a pattern can be formed with high accuracy and, at the same time, the throughput of a substrate treating process can be improved as a whole. SOLUTION: This substrate treating system comprises a spinner which applies a resist to a substrate, a pattern exposure system which performs pattern exposure, and a host computer which generalizes and controls the spinner and exposure system. When the resist is applied to the substrate, the spinner measures the thickness of the formed resist film (step S104). The thickness of the resist film is transmitted to the host computer 3 and, further, transferred to the pattern exposure system (steps S105-S201). The pattern exposure system decides the luminous exposure for pattern exposure in accordance with the received thickness of the resist film (step S202). Since the thickness of the resist film is measured by means of the spinner having a relatively long margin in its processing time, the processing time of the pattern exposure system is reduced and the throughput of the substrate treating process can be improved as a whole. COPYRIGHT: (C)2004,JPO&NCIPI