SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device from which a shielding case does not secede when reflow packaging is performed. SOLUTION: In the semiconductor device, a chip is mounted on a conductive pattern of a substrate 4, and the whole body is sealed with resin. The shielding case 3 is...

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Bibliographische Detailangaben
1. Verfasser: OKA JUNJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device from which a shielding case does not secede when reflow packaging is performed. SOLUTION: In the semiconductor device, a chip is mounted on a conductive pattern of a substrate 4, and the whole body is sealed with resin. The shielding case 3 is embedded in the sealing resin. A part of the shielding case 3 is protruded from the surface of the sealing resin and formed into a GND terminal 3a. COPYRIGHT: (C)2004,JPO&NCIPI