METHOD OF MANUFACTURING THICK FILM MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a thick film multilayer wiring board having enhanced connection reliability by eliminating cavities generated in a substrate interface at a connecting portion between a bonding pad layer consisting of a gold-base conductor and a silver-base...

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Bibliographische Detailangaben
Hauptverfasser:	KOGUCHI HIDEKAZU, AKUTSU YASUO, TSURUMAKI KIYOSHI, MATSUI ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a thick film multilayer wiring board having enhanced connection reliability by eliminating cavities generated in a substrate interface at a connecting portion between a bonding pad layer consisting of a gold-base conductor and a silver-base or silver-platinum-base conductor layer which is superposed on the bonding pad layer for establishing an electrical connection. SOLUTION: In the method of manufacturing a thick film multilayer wiring board, by laying a glass-frit-base insulating glass layer 24 over a portion where a bonding pad 14 consisting of a gold-base conductor and conductor wiring 16 consisting of a silver-base or silver-platinum-base conductor are superposed with each other, the thick film multilayer wiring board 10 wherein cavities that have been generated in the substrate interface of the connecting portion are eliminated, can be obtained. Accordingly, the thick film multilayer wiring board high in reliability can be obtained. COPYRIGHT: (C)2004,JPO&NCIPI