FLEXIBLE COPPER-CLAD LAMINATED PLATE AND ITS PRODUCTION METHOD

PROBLEM TO BE SOLVED: To materialize a flexible copper-clad laminated plate which is good in naneuverability and stress relaxation performance of copper foil during the production of the laminated plate, excellent in flexibility and folding resistance, and capable of precise patterning. SOLUTION: Th...

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1. Verfasser:	TAKARABE TAEKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To materialize a flexible copper-clad laminated plate which is good in naneuverability and stress relaxation performance of copper foil during the production of the laminated plate, excellent in flexibility and folding resistance, and capable of precise patterning. SOLUTION: The flexible copper-clad laminated plate 1 has a base layer 6 including a polyimide resin layer and a copper foil layer 2 joined to one surface of the base layer 6. The copper foil layer 2 is made of electrolytic copper foil. In the profile of the copper foil, when the copper foil is subjected to specified heat treatment at 320°C and for 30 m, the value of the tension of the copper foil before the heat treatment is 450-500 MPa, and a value obtained by dividing the tension of the electrolytic copper foil before the heat treatment by the tension of the copper foil after the heat treatment is 2.5-3.3. COPYRIGHT: (C)2004,JPO&NCIPI