SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of preventing the lower surface of a substrate from being contaminated by a nozzle while keeping the nozzle disposed apart from the lower surface of the substrate, and a substrate processing method. SOLUTION: The upper end par...

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Bibliographische Detailangaben
1. Verfasser:	ANDO YUKITSUGU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of preventing the lower surface of a substrate from being contaminated by a nozzle while keeping the nozzle disposed apart from the lower surface of the substrate, and a substrate processing method. SOLUTION: The upper end part of a lower part washing nozzle 29 is fitted with a tabular cut off member 30 at the upper end part of the nozzle body, and the upper surface 30a thereof faces the lower surface of a wafer W supported by a support pin. A nozzle washing liquid is discharged from a discharge port provided at the cut off member 30 of the lower part washing nozzle 29 toward the lower surface of the wafer W to form a liquid pool P of the nozzle washing liquid between the whole upper surface of the cut off member 30 and the lower surface of the wafer W. As a result, the whole upper surface of the cut off member 30 comes into contact with the nozzle washing liquid, and thereby an adherent material adhered on the upper surface 30a is surely removed. COPYRIGHT: (C)2004,JPO&NCIPI