SPLIT SUBSTRATE

PROBLEM TO BE SOLVED: To provide a split substrate for which individual small substrates can be simply tested with a small number of test pins while the small substrates are in a collective state as they are, without increasing the area of the small substrate itself. SOLUTION: The split substrate is constituted of a plurality of small substrates 10 and a peripheral substrate 20 outside the small substrates positioned at the surroundings of the small substrates 10, wherein at least one semiconductor device 103 is mounted on each small substrate 10. The semiconductor device 103 has a function of making an inspection-signal output port 102 high-impedance state by ID selection, and has a structure of pulling up or pulling down the ID-setting input terminals 106 in the inside of the semiconductor device 103. Input/output lines for an inspection signal and a power supply line are drawn from each small substrate 10 to the peripheral substrate 20, wherein the signal line from each small substrate 10 is commonly connected to a pad arranged on the peripheral substrate 20. An ID signal for ID setting is inputted to each semiconductor device 103 via the ID-setting input terminals 106. An ID is selected based on the inputted ID signal to bring the inspection-signal output ports 102 into a high impedance state by the ID selection. COPYRIGHT: (C)2004,JPO&NCIPI