CAMERA MODULE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a camera module that has an inexpensive structure, capable of preventing an underfill material for sealing an imaging device to a substrate from flowing into a light reception section, and further suppressing the generation of dust from the inner and side walls of a hole on the substrate and preventing a flaring or the like. SOLUTION: A section for preventing the flow of an underfill material is formed. At the section, a land 13, a resist layer 14, and a silk print layer 15 are laminated while surrounding a through hole 5 on the substrate 6. When the imaging device 8 is subjected to flip-chip packaging, the section for preventing the flow of the underfill material prevents the underfill material 7 to be filled from flowing into the light reception section 9. COPYRIGHT: (C)2004,JPO&NCIPI