MOUNTING STRUCTURE OF ELECTRONIC COMPONENT

MOUNTING STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To prevent conductive adhesives flowing out from pads from being brought into contact with each other, and to prevent excess current from flowing between the pads and from causing a shorting. SOLUTION: A mounting structure of electronic component, in which the conductive adhesi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HIROSHIMA YOSHIYUKI, TSUBONE KENICHIRO
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent conductive adhesives flowing out from pads from being brought into contact with each other, and to prevent excess current from flowing between the pads and from causing a shorting. SOLUTION: A mounting structure of electronic component, in which the conductive adhesive is applied onto two confronted electrodes arranged on a substrate and an electronic component is mounted is characterised in that one electrode has a storage storing conductive adhesive on the other electrode side rather than a center position of one electrode. By this mounting structure of electronic component, the problem discribed above is solved. COPYRIGHT: (C)2004,JPO&NCIPI