METHOD FOR MOUNTING ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To provide a method for mounting electronic equipment in which a complicated assembly process for a cover, a plate, and a substrate can be simplified by a positioning method for ensuring the reliability of an aluminum wire. SOLUTION: The abutting sections of the plate 2 and the...

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Bibliographische Detailangaben
Hauptverfasser:	EBISAWA MAKOTO, SUGAWARA HAYATO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for mounting electronic equipment in which a complicated assembly process for a cover, a plate, and a substrate can be simplified by a positioning method for ensuring the reliability of an aluminum wire. SOLUTION: The abutting sections of the plate 2 and the substrate 3 are formed to two sides, on which there are a large number of terminals for the cover 1 for ensuring a reliability to the temperature change of the aluminum wires 4, and each is fixed. The aluminum wires 4 are bonded among the terminals for the cover 1 and the substrate 3. COPYRIGHT: (C)2004,JPO&NCIPI