METHOD FOR POLISHING SINGLE CRYSTAL SUBSTRATE

METHOD FOR POLISHING SINGLE CRYSTAL SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for polishing an extremely thin single crystal substrate with a single crystal substrate thickness of about 30 μm or less. SOLUTION: The single crystal substrate is stuck to a polishing plate through a glass pane or a metal plate, and after grinding and poli...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FURUTAKI TOSHIRO, SUNAKAWA KAZUHIKO
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for polishing an extremely thin single crystal substrate with a single crystal substrate thickness of about 30 μm or less. SOLUTION: The single crystal substrate is stuck to a polishing plate through a glass pane or a metal plate, and after grinding and polishing one side of the single crystal substrate, the single crystal substrate is detached from the polishing plate together with the glass pane or metal plate. The glass pane or metal plate is dissolved to remove the glass pane or metal plate from the single crystal substrate. The single crystal substrate is thereby detached from the polishing plate without initiating crack in the extremely thin single crystal substrate. COPYRIGHT: (C)2004,JPO&NCIPI