FLUX COMPOSITION FOR SOLDERING, CREAM SOLDER COMPOSITION AND ELECTRONIC COMPONENTS

PROBLEM TO BE SOLVED: To provide a flux composition which does not give rise to cracking in the residual films of a flux after soldering even under the environment of extremes of temperature difference and can form the residual films of the flux exhibiting a moistureproof effect by covering a solder...

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Bibliographische Detailangaben
Hauptverfasser:	NARITA MASAHIRO, ISHIGA FUMIO, YOSHIOKA TAKAYASU, YOSHITOMI MANABU, NAKAMURA MITSUO, HAYASHI MASAYOSHI, ITO TAKESHI, KOJIMA HIROMITSU, TANAKA YASUHISA, FUKATSU KATSUTOSHI, KUWAYAMA WATARU, ISHIGURO YOSHINOBU, MAENO JUNICHI, HARA ATSUMASA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flux composition which does not give rise to cracking in the residual films of a flux after soldering even under the environment of extremes of temperature difference and can form the residual films of the flux exhibiting a moistureproof effect by covering a solder surface and circuit surface and electronic components having the residual films of the flux. SOLUTION: The flux composition for soldering containing a polyether ester amide resin and/or dimer acids, the cream solder composition and the electronic components having the residual films of the flux are provided. COPYRIGHT: (C)2004,JPO&NCIPI