MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF AND IMAGE DISPLAY DEVICE

PROBLEM TO BE SOLVED: To make considerably easily manufacturable an arbitrary wiring board with a high productivity, at a low cost and with high reliability. SOLUTION: The multilayer wiring board is provided with a single wiring layer formed by using a thin film metal 11, the other wiring layer diff...

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Bibliographische Detailangaben
1. Verfasser:	NAKAJIMA HIDEHARU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To make considerably easily manufacturable an arbitrary wiring board with a high productivity, at a low cost and with high reliability. SOLUTION: The multilayer wiring board is provided with a single wiring layer formed by using a thin film metal 11, the other wiring layer different from the single wiring layer and an interlayer insulating film which is installed between the single wiring layer and the other wiring layer and is formed of a prescribed insulating material. The multilayer wiring board is formed by integrally forming a via for electrically connecting the single wiring layer and the other wiring layer in forming the single wiring layer formed by using the thin film metal 11. COPYRIGHT: (C)2004,JPO&NCIPI