BACKUP SHEET FOR BORING THROUGH-HOLE WITH LASER

PROBLEM TO BE SOLVED: To provide a backup sheet which is used for primarily boring a well-shaped through-hole of small diameter in a copper-plated board by irradiating it with a carbon dioxide gas laser, formed by depositing a resin layer loaded with an adhesive agent that is adhesive at a room temp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IKEGUCHI NOBUYUKI, AOTO HIROKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a backup sheet which is used for primarily boring a well-shaped through-hole of small diameter in a copper-plated board by irradiating it with a carbon dioxide gas laser, formed by depositing a resin layer loaded with an adhesive agent that is adhesive at a room temperature on a metal foil to serve as the backup sheet, pasted on the copper-plated board at a room temperature so as to prevent the copper-plated board from warping, and can be easily separated. SOLUTION: A resin composition loaded with the adhesive agent is applied on the surface of the metal foil for the formation of the backup sheet, the backup sheet is arranged, laminated on the rear surface of the copper-plated board and bonded together at a room temperature, and a carbon dioxide laser is made to irradiate the front surface of the copper-plated board to bore a through-hole in the board. COPYRIGHT: (C)2004,JPO&NCIPI