SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To properly improve the heat dissipation property of a semiconductor element in a resin-sealed semiconductor device. SOLUTION: The semiconductor device S1 comprises an IC chip 10 as a semiconductor element and a lead 30 electrically connected to the IC chip 10 via a bonding wir...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NUMAZAKI KOJI, NAGATANI TOSHIHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To properly improve the heat dissipation property of a semiconductor element in a resin-sealed semiconductor device. SOLUTION: The semiconductor device S1 comprises an IC chip 10 as a semiconductor element and a lead 30 electrically connected to the IC chip 10 via a bonding wire 20, wherein the IC chip 10 and the lead 30 are molded with resin 40. The lead 30 extends toward the IC chip 10, and an aluminum substrate 50 as an intervened member having electrical insulation and being more excellent in thermal conductivity than the resin 40 used for molding is intervened between the extended lead 30 and the IC chip 10. COPYRIGHT: (C)2004,JPO&NCIPI