FIELD SENSING ELEMENT INTEGRATED ON SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING IT

PROBLEM TO BE SOLVED: To provide an ultrasmall, high-sensitivity field sensing element integrated on a semiconductor substrate in such a manner as to be capable of detecting magnetic fields more accurately, and a method for producing it; and to prevent an induced waveform from appearing in a flux va...

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Bibliographische Detailangaben
Hauptverfasser: RA KEIEN, SHIM DONG-SIK, CHOI SANG-ON, PARK HAE-SEOK
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an ultrasmall, high-sensitivity field sensing element integrated on a semiconductor substrate in such a manner as to be capable of detecting magnetic fields more accurately, and a method for producing it; and to prevent an induced waveform from appearing in a flux variation sensing coil when an externally measured magnetic field is zero. SOLUTION: The field sensing element integrated on a semiconductor substrate is disclosed. The field sensing element forms two bar-shaped soft magnetic cores formed on the same plane in such a manner as to form a closed magnetic path on the semiconductor substrate, and forms an exciting coil with either a coupled structure having a shape in which the two bar-shaped soft magnetic cores are wound in the shape of the figure eight, or a separated structure having a shape in which the bars are separated and wound. Also, a field variation sensing coil is formed to have either a winding structure in which it is stacked on the exciting coil with the two bars both wound around it in the form of a solenoid at a time, or a structure in which the bars are separated from each other and wound. COPYRIGHT: (C)2004,JPO&NCIPI