SEMICONDUCTOR SUBSTRATE WITH THROUGH ELECTRODE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor substrate by which the manufacturing cost can be reduced and products are also manufactured with a high yield, a semiconductor substrate with a through electrode that is manufactured by the method, and an electronic device u...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKIZAWA ISAO, YAMAMOTO SATOSHI
Format: Patent
Sprache:eng
Schlagworte:
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