SEMICONDUCTOR SUBSTRATE WITH THROUGH ELECTRODE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor substrate by which the manufacturing cost can be reduced and products are also manufactured with a high yield, a semiconductor substrate with a through electrode that is manufactured by the method, and an electronic device using the same. SOLUTION: The method for manufacturing the semiconductor substrate 6 with a through electrode includes a step where a micro hole 2 of the semiconductor substrate 1 made only on one main surface of the semiconductor substrate 1 is filled with a conductive substance to form a filled part 4, a step where the other main surface 1b of the semiconductor substrate 1 is etched to protrude the filled part 4 from the other main surface 1b thereof, a step where an insulation layer 32 is formed in a smaller thickness than a projecting height of the filled part 4 from the other main surface 1b, and the step where the section of the filled part 4 projecting from the insulation layer 32 is ground to make the filled part 4 to be an electrode penetrating the semiconductor substrate 1. COPYRIGHT: (C)2004,JPO&NCIPI