MANUFACTURING METHOD FOR SUPER-ABRASIVE GRAIN WIRE SAW

PROBLEM TO BE SOLVED: To supply a long-life super-abrasive grain wire saw that prevents a bonding material from stripping caused by a drop of super-abrasive grains to enable high-accuracy and high-efficiency slicing of the fixed super-abrasive grain wire saw. SOLUTION: The projected area of the supe...

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Bibliographische Detailangaben
Hauptverfasser:	OGAWA HIDEKI, YAMANAKA MASAAKI, URAKAWA NOBUO, NAKAI MASANORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To supply a long-life super-abrasive grain wire saw that prevents a bonding material from stripping caused by a drop of super-abrasive grains to enable high-accuracy and high-efficiency slicing of the fixed super-abrasive grain wire saw. SOLUTION: The projected area of the super-abrasive grains D occupies more than 5% and less than 55% of the surface area of a core wire W of the super-abrasive grain wire saw P where the super-abrasive grains D are fixed on the core wire W by the bonding material R. The projected area of the super-abrasive grains D is controlled to occupy more than 5% and less than 55% of the surface area of the core wire W by changing the mixture ratio of the super-abrasive grains D and the bonding material R. COPYRIGHT: (C)2004,JPO&NCIPI