MODULE

PROBLEM TO BE SOLVED: To provide an electronic component, especially a module, that has a higher dielectric constant as compared with a conventional material, prevents deterioration in strength, is compact and has high performance, and has excellent total electric characteristics, an electronic comp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ENDO TOSHIICHI, TAKATANI MINORU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic component, especially a module, that has a higher dielectric constant as compared with a conventional material, prevents deterioration in strength, is compact and has high performance, and has excellent total electric characteristics, an electronic component, especially a module, capable of suppressing electric characteristics in a material to be used, especially variation between lots of the dielectric constants, and an electronic component having a high withstand voltage, especially a module. SOLUTION: The module is equipped with a structure being multilayered by laminating configuration layers having resin. At least one of the configuration layers is the layer of a composite dielectric material where a dielectric whose projection shape is at least circular, flat circular, or elliptic is dispersed in the resin. COPYRIGHT: (C)2004,JPO&NCIPI