PACKAGING METHOD FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR CIRCUIT

PROBLEM TO BE SOLVED: To provide a packaging method for a semiconductor element for manufacturing a semiconductor circuit with high productivity, which moderates any strain produced at a junction part of the semiconductor element and a substrate owing to a temperature change, and also to provide the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	EGUCHI TOSHIYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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