PACKAGING METHOD FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR CIRCUIT

PROBLEM TO BE SOLVED: To provide a packaging method for a semiconductor element for manufacturing a semiconductor circuit with high productivity, which moderates any strain produced at a junction part of the semiconductor element and a substrate owing to a temperature change, and also to provide the semiconductor circuit manufactured by the packaging method. SOLUTION: The packaging method for flip-chip packaging a semiconductor element on the substrate comprises processes of: joining an electrode on the substrate and an electrode of the semiconductor element; and forming a film at the junction part of the electrode on the substrate and the electrode of the semiconductor element with the aid of an atmospheric pressure plasma method. COPYRIGHT: (C)2004,JPO&NCIPI