METHOD OF PRODUCING PIEZOELECTRIC COMPONENT AND PIEZOELECTRIC COMPONENT

METHOD OF PRODUCING PIEZOELECTRIC COMPONENT AND PIEZOELECTRIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of producing a surface acoustic wave (SAW) device which is highly reliable and can be miniaturized and produced at a low cost by surely sealing a mounting substrate and a SAW element by a resin film, and the SAW device. SOLUTION: A SAW element 2 is mounted o...

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Bibliographische Detailangaben
Hauptverfasser: ARAKI NOBUNARI, SHINKAI HIDEKI, HIGUCHI MASATO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of producing a surface acoustic wave (SAW) device which is highly reliable and can be miniaturized and produced at a low cost by surely sealing a mounting substrate and a SAW element by a resin film, and the SAW device. SOLUTION: A SAW element 2 is mounted onto a mounting substrate 1 having an external terminal 7 via a bump 3 by flip chip bonding, the SAW element 2 is then covered with a resin film 10, and the periphery of the SAW element 2 mounted on the mounting substrate 1 is covered with a part of the resin film 10 so that the SAW element 2 is sealed. The resin film 10 is hardened. Thus, the SAW device is provided. COPYRIGHT: (C)2004,JPO&NCIPI