METHOD OF MANUFACTURING BASE MATERIAL FOR MULTILAYERED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of manufacturing base material for multilayered substrate by which interlayer continuity can be obtained highly reliably with a low resistance by using conductive paste without causing any defect nor fault in the protruded part of the conductive paste during...

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Bibliographische Detailangaben
Hauptverfasser:	SATO MASAKAZU, ITO SHOJI, NAGATA MASAKATSU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing base material for multilayered substrate by which interlayer continuity can be obtained highly reliably with a low resistance by using conductive paste without causing any defect nor fault in the protruded part of the conductive paste during the course of manufacturing a base material for multilayered substrate. SOLUTION: After a mask film 17 which comes into contact with the conductive paste 16 packed in the holes 14 of a polyimide film 11 is partially removed and gaps 18 are provided between the outer peripheral surface of the conductive paste 16 and the inner peripheral surfaces of the mask film portions of the holes 14, the mask film 17 is peeled off. COPYRIGHT: (C)2004,JPO&NCIPI