PLATING METHOD AND TOOL FOR PLATING USED FOR THE METHOD

PLATING METHOD AND TOOL FOR PLATING USED FOR THE METHOD

PROBLEM TO BE SOLVED: To provide a plating method by which a uniform plating film can be formed on a member to be plated by preventing maleffect, such as warping, to the member to be plated. SOLUTION: In a method for applying the plating to a doctor blades 1, 2 by dipping the doctor blades 1, 2 into...

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Bibliographische Detailangaben
Hauptverfasser: KISHIMOTO KAZUYUKI, TAKANO SHIZUO, TAKEUCHI YASUHARU
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a plating method by which a uniform plating film can be formed on a member to be plated by preventing maleffect, such as warping, to the member to be plated. SOLUTION: In a method for applying the plating to a doctor blades 1, 2 by dipping the doctor blades 1, 2 into a plating solution and supplying electricity to the doctor blades 1, 2, both one pair of doctor blades 1, 2 are facedly disposed and cathodes are connected to one pair of doctor blades 1, 2, respectively, and positive electrode 3 is disposed at the position of almost the equal distance from one pair of doctor blades 1, 2, and the interval between both one pair of doctor blades, is adjusted according to current density during plating treatment. COPYRIGHT: (C)2004,JPO&NCIPI