BONDED STRUCTURAL BODY

PROBLEM TO BE SOLVED: To provide a bonded structural body wherein the thickness of an adhesives layer is specified by installing a layer thickness specifying means, and shearing stress generated in an adhered surface can be absorbed by the adhesives layer. SOLUTION: An adhesives charge trench 14 whi...

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Bibliographische Detailangaben
Hauptverfasser: KUWABARA HIROBUMI, HASE ATSUSHI, KINOSHITA YASUAKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a bonded structural body wherein the thickness of an adhesives layer is specified by installing a layer thickness specifying means, and shearing stress generated in an adhered surface can be absorbed by the adhesives layer. SOLUTION: An adhesives charge trench 14 which specifies the thickness T1 of the adhesives layer 15 is formed at a rotor shaft 12 in such a manner that the shearing stress generated in interfaces I1, I2 which is caused by the linear expansion difference of the rotor shaft and a neodymium system magnet 13 can be absorbed by the adhesives layer 15. COPYRIGHT: (C)2004,JPO&NCIPI