PLASMA TREATING APPARATUS AND PLASMA TREATING METHOD

PROBLEM TO BE SOLVED: To provide a plasma treating apparatus and a plasma treating method preventing an influence due to the heat reception of a dielectric, and applying a high fidelity plasma treatment to an object to be treated. SOLUTION: This plasma treating apparatus is characterized by having a...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI JUNYA, ISHIHAMA HITOSHI, ODA HIROHISA, NAKAYAMA TOMIO, KURAMOCHI KAZUMICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plasma treating apparatus and a plasma treating method preventing an influence due to the heat reception of a dielectric, and applying a high fidelity plasma treatment to an object to be treated. SOLUTION: This plasma treating apparatus is characterized by having a vacuum container in which an object to be treated is housed, and plasma treatment is operated to the object to be treated under a vacuum or pressure reducing environment; a dielectric for transmitting microwaves through the vacuum container, and for maintaining the pressure reducing or vacuum environment of the vacuum container; a plane board having a slot for guiding the microwaves to the dielectric; and a cooling mechanism arranged between the plane and the dielectric for cooling the dielectric. COPYRIGHT: (C)2004,JPO&NCIPI