METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To obtain a method for manufacturing a multilayer wiring board not having a core substrate but having a build-up layer and a supporting frame in which production efficiency is enhanced. SOLUTION: An adhesive layer 10 is formed on the rear surfaces 1b and 1b of a pair of metal s...

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Bibliographische Detailangaben
Hauptverfasser:	KANBE ROKURO, HIRANO SATOSHI, MIYAMOTO SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a method for manufacturing a multilayer wiring board not having a core substrate but having a build-up layer and a supporting frame in which production efficiency is enhanced. SOLUTION: An adhesive layer 10 is formed on the rear surfaces 1b and 1b of a pair of metal substrates 1 and 1 having a surface and a rear surface and while facing the rear surfaces 1b and 1b on which the adhesive layer 10 is formed each other, these metal substrates 1 and 1 are stacked through a release sheet r. Subsequently, a build-up layer BU is formed simultaneously on the surfaces 1a and 1a of these stacked metal substrates 1 and 1. COPYRIGHT: (C)2004,JPO&NCIPI