SOLID-STATE IMAGING DEVICE

PROBLEM TO BE SOLVED: To prevent unnecessary light from laterally entering a solid-state imaging element mounted on a glass wiring board and exerting an adverse influence on the operation of the solid-state imaging element, to simplify a process of bonding a housing and the glass wiring board togeth...

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Bibliographische Detailangaben
1. Verfasser: MUSHA KAZUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent unnecessary light from laterally entering a solid-state imaging element mounted on a glass wiring board and exerting an adverse influence on the operation of the solid-state imaging element, to simplify a process of bonding a housing and the glass wiring board together, and to improve the reliability of the bonding of the solid-state imaging device consisting at least of the housing, a lens, an infrared-ray cutting filter, the glass wiring board, and the solid-state imaging element mounted on the glass wiring board. SOLUTION: The solid-state imaging device is provided at a housing end with a recessed part where the glass wiring board mounted with the solid-state imaging element is disposed and stored, and also provided with a guide part for laterally sliding and inserting the glass wiring board into the recessed part. COPYRIGHT: (C)2004,JPO