ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To dissipate heat from an exothermic module efficiently for the heat from the module not to affect one other module, and, also, to dissipate heat from the other module efficiently. SOLUTION: The inside of a case 1 is divided by a partition plate 2 having a backboard 5 attached...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAKAMOTO YUZURU, TAKAYASU TETSUFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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