ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To dissipate heat from an exothermic module efficiently for the heat from the module not to affect one other module, and, also, to dissipate heat from the other module efficiently. SOLUTION: The inside of a case 1 is divided by a partition plate 2 having a backboard 5 attached...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKAMOTO YUZURU, TAKAYASU TETSUFUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To dissipate heat from an exothermic module efficiently for the heat from the module not to affect one other module, and, also, to dissipate heat from the other module efficiently. SOLUTION: The inside of a case 1 is divided by a partition plate 2 having a backboard 5 attached thereto into a front-side lowly exothermic module housing section 3 and a rear-side highly exothermic module housing section 4. The case 1 is provided with an air intake port 23 communicating with the lower part of the highly exothermic module housing section 4, and with an exhaust port 27 communicating with the upper part of the highly exothermic module housing section 4. COPYRIGHT: (C)2004,JPO