CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate formed by lamination and baking, and its manufacturing method. SOLUTION: The multilayer substrate formed by laminating and baking many ceramic substrates comprises a pattern layer 202 which is formed in an entire or a part of the many c...

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Bibliographische Detailangaben
Hauptverfasser: JUN SEOK TAEK, CHOI IK SEO, LEE YOUNG KEUN
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate formed by lamination and baking, and its manufacturing method. SOLUTION: The multilayer substrate formed by laminating and baking many ceramic substrates comprises a pattern layer 202 which is formed in an entire or a part of the many ceramic substrates 203 and embodies a prescribed circuit element; a connection rod 210 which is formed in a position adjacent to an outer side of the ceramic substrate 203 inside a pattern extended to an outer side of the ceramic substrate 203 exchanging a middle outer part of the pattern layer 202 and a signal and is formed to pass through the ceramic substrate 203 vertically; at least one through groove 205 which is formed in an outer side of the many laminated ceramic substrates 203 and is formed so that the connection rod 210 is exposed to an inner side with one side opened; and an outer terminal formed in an outer wall of the through groove 205. COPYRIGHT: (C)2004,JPO