LIGHT EMITTING ELEMENT

PROBLEM TO BE SOLVED: To provide a light emitting device which can prevent breakdown by fatigue of a bump even when the environmental temperature difference for use is large. SOLUTION: A space between an LED chip 2 and lead frames 3, 4 is filled with an underfill 7 in place of the transparent resin 9, which is smaller in the line expansion coefficient than the transparent resin 9, or more preferably is equivalent in the line expansion coefficient to the Au bump. Therefore, the light emitting element 1 which can surely prevent breakdown with fatigue of the Au bump 6 can be provided by making smaller the compressed stress or tensile stress generated on the Au bump 6 due to the difference between the line expansion coefficients of the Au bump 6 and underfill 7 than that of the light emitting element of the prior art, even if the environmental temperature changes to a large extent during use of the light emitting element 1. COPYRIGHT: (C)2004,JPO