SHEET-SHAPED ELECTRONIC COMPONENT MODULE

PROBLEM TO BE SOLVED: To provide a sheet-shaped electronic component module capable of increasing mounting area of the peripheral circuit by connecting electronic components near to the IC. SOLUTION: A sliding plate 17 in which a through hole 21 larger than the connecting pin 2 is provided in compli...

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1. Verfasser: FUJIYAMA TERUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a sheet-shaped electronic component module capable of increasing mounting area of the peripheral circuit by connecting electronic components near to the IC. SOLUTION: A sliding plate 17 in which a through hole 21 larger than the connecting pin 2 is provided in compliance with the pitch of the through holes of the main body is arranged on the substrate face in free sliding, and a spring 20 biasing the connecting pin 2 so as to be pinched by the through hole 21 provided at this sliding plate 17 and the contact part of the main body is provided. Thereby, since elasticity works in the direction of pinching the connecting pin 2 at each hole of the sliding plate 17 and each contact part, the connecting pin 2 is locked and electrical connection between the contact part and the connecting pin 2 can be steadily performed. COPYRIGHT: (C)2004,JPO