ALKALI DEVELOPABLE PHOTOSETTING/THERMOSETTING COMPOSITION AND HARDENED FILM OBTAINED FROM THE SAME

PROBLEM TO BE SOLVED: To obtain a hardened film which is excellent in heat resistance, adhesiveness, resolution, durability against electroless plating, electric characteristics or the like required for a solder resist of a printed wiring board, an interlayer insulating layer of a multilayer wiring...

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Bibliographische Detailangaben
Hauptverfasser: YODA KYOICHI, SEKIMOTO AKIO, ARIMA MASAO, SUGITA SHIYOUJI, KIMURA NORIO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a hardened film which is excellent in heat resistance, adhesiveness, resolution, durability against electroless plating, electric characteristics or the like required for a solder resist of a printed wiring board, an interlayer insulating layer of a multilayer wiring board, or the like, in particular, which is excellent in resistance against moisture absorption and PCT (pressure cooker) durability required for an IC package. SOLUTION: The following alkali developable photosetting/thermosetting composition is obtained. The composition contains: (A) a photosensitive prepolymer obtained by allowing (d) a polybasic acid anhydride to react with an alcoholic hydroxyl group in the reaction product (X) of (a) an epoxy compound having two or more epoxy groups in one molecule, (b) a phenol compound expressed by specified formula and/or a naphthol compound expressed by specified formula, and (c) an unsaturated group-containing monocarboxylic acid; (B) a polyfunctional unsaturated compound as a diluent which is liquid at room temperature and/or an organic solvent; (C) a photopolymerization initiator; (D) an epoxy resin and (E) a hardening catalyst. COPYRIGHT: (C)2004,JPO