SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a semiconductor device and the manufacturing method thereof the improvement of whose reliability is intended. SOLUTION: The semiconductor device comprises a semiconductor chip 1 having a plurality of pads, a wiring board 3 having a plurality of connection electrodes 3c provided correspondingly to the plurality of pads and having dummy electrodes 3d provided in the corner portions of the electrode array comprising the plurality of connection electrodes 3c, a plurality of solder bumps whereby the pads of the semiconductor chip 1 and the connection electrodes 3c of the wiring board 3 are connected in a flip-chip way, and a plurality of solder balls provided on the rear surface of the wiring board 3. In this case, by providing the dummy electrodes 3d of the board-side in the further more outside corner portions than the solder bumps provided in the corners of the electrode array of the semiconductor chip 1, since each chip-corner pin becomes a non-corner portion in the electrode array present on the board, the oxygen content of each electrode present on the board which corresponds to each chip-corner pin can be made less. As a result, the bump-connection faultiness generated in each chip-corner pin is so prevented as to make improvable the reliability of a product. COPYRIGHT: (C)2004,JPO