ELECTRONIC COMPONENT FOR SURFACE MOUNTING, AND METHOD OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide an electronic component for surface mounting having the folding strength resistive to breakdown to occur when stress is applied thereto in the manufacturing process or after the manufacturing thereof, and also to provide a method of manufacturing the same electronic...

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Bibliographische Detailangaben
Hauptverfasser:	KINOSHITA TAIJI, HOSHITOKU SEIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY RESISTORS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component for surface mounting having the folding strength resistive to breakdown to occur when stress is applied thereto in the manufacturing process or after the manufacturing thereof, and also to provide a method of manufacturing the same electronic component. SOLUTION: A plurality of recesses 12, which do not reach the lower surface from the upper surface in the thickness direction of a substrate 11, are provided at the end faces which are provided oppositely of the substrate 11 as an electronic component body. Moreover, a resistor 13 as a function element is provided between the recesses 12 provided oppositely. In addition, an external electrode 17 connected to the resistor 13 is also provided to include the recesses 12. COPYRIGHT: (C)2004,JPO