SEMICONDUCTOR ELEMENT AND METHOD FOR WIRING ELEMENT

PROBLEM TO BE SOLVED: To supply a module in a chip with power without providing a power supply line in the chip. SOLUTION: A silicon interposer substrate 51 comprises an interposer side power supply line 53 and an interposer 52 having an interposer side power supply line 54. Chips 61 and 62 are not provided with a power supply line in the chip but the interposer side power supply lines 53 and 54 are formed up to the position of a bump 16 for supplying power to the modules 31-34, respectively. Consequently, the modules 31-34 are supplied with power without forming a power supply line in the chip. The invention is applicable to a semiconductor chip employing a silicon interposer substrate. COPYRIGHT: (C)2004,JPO