EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC PART DEVICE

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing, excellent in laser marking property and electric characteristics, causing no short circuit due to electroconductive materials even in an electronic part device with a narrow interval between pads or wires and having excellent mo...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEMIYA KEIZO, ABE HIDENORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PREPARATION OF CARBON BLACK SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing, excellent in laser marking property and electric characteristics, causing no short circuit due to electroconductive materials even in an electronic part device with a narrow interval between pads or wires and having excellent moldability, reliability and package surface externals, and to provide electronic part devices using the epoxy resin composition. SOLUTION: The epoxy resin composition for sealing comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent, (C) non-electroconductive carbon and (D) an inorganic filler, wherein the mean particle diameter of (C) the non-electroconductive carbon is 0.3-50 μm. The electronic part device is equipped with elements sealed with the epoxy resin composition. COPYRIGHT: (C)2004,JPO