ABRASIVE GRAIN FOR POLISHING, MANUFACTURING METHOD THEREFOR, AND ABRASIVE

PROBLEM TO BE SOLVED: To provide abrasive grains for high-performance polishing, having small particle diameters with a narrow particle diameter distribution, capable of giving a high rate of polishing with little occurrence of a damage, such as a scratch, on the surface of a processed material, a m...

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Bibliographische Detailangaben
Hauptverfasser: NAKADA HIDETO, YOKOYAMA KENZO, HAMAMOTO SHINJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide abrasive grains for high-performance polishing, having small particle diameters with a narrow particle diameter distribution, capable of giving a high rate of polishing with little occurrence of a damage, such as a scratch, on the surface of a processed material, a method for simply and easily manufacturing the abrasive grains, and an abrasive containing the abrasive grains. SOLUTION: The abrasive grains for polishing comprise a composite oxide obtained by mixing an aqueous solution containing celium(III) nitrate and zirconium nitrate respectively in amounts in terms of celium oxide of 10-95 mass% and zirconium oxide of 5-90 mass% based on 100 mass% total of those in terms of oxides with a precipitant comprising an aqueous ammonia, raising the temperature of the mixture to 100°C in 7 min and aging it for 1 hr, and having a mean particle diameter of 0.1 nm to below 10 nm. The abrasive grains are obtained without baking at a high temperature and have an excellent polishing performance. COPYRIGHT: (C)2004,JPO