CALIBRATION METHOD OF CHARGED BEAM ALIGNER AND THE CHARGED BEAM ALIGNER

PROBLEM TO BE SOLVED: To provide a calibration method of a charged beam aligner and an aligner for improving connection accuracy between subfields by reducing strain such as rotation, magnification and quadrature error of an image of a subfield on a wafer surface. SOLUTION: A mark arrangement subfie...

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1. Verfasser: OKINO TERUAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a calibration method of a charged beam aligner and an aligner for improving connection accuracy between subfields by reducing strain such as rotation, magnification and quadrature error of an image of a subfield on a wafer surface. SOLUTION: A mark arrangement subfield group 140 consisting of a subfield 142 marked with a reticle fiducial mark 146 is formed on a reticle stage 11 of an aligner. A mark arrangement subfield group 150 consisting of a subfield 152 with a wafer fiducial mark 156 arranged is formed on a wafer stage 24. A series of subfields of each mark arrangement subfield group are arranged along a beam scanning path corresponding to the charged beam deflection state and the mechanical operation form of both stages. The mutual position error of both marks is detected while performing deflection scanning for a series of subfields in the same time-series as that in beam exposure. COPYRIGHT: (C)2004,JPO