SUBSTRATE TREATMENT METHOD

PROBLEM TO BE SOLVED: To provide a treatment method in which the number of releases of a load-locked chamber is decreased even when a dummy wafer is used. SOLUTION: In this treatment method, the dummy wafer is housed in wafer cassettes 30a and 30b set in the load-locked chambers 16a and 16b together...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOSHINO KATSUHIKO, MACHIDA TERUHISA
Format: Patent
Sprache:eng
Schlagworte:
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